Following a competitive selection process, 20 Application Experiments (AE) will be selected and conducted to demonstrate the transfer of flexible electronics technologies into new products, processes, business models and business opportunities.
Application Experiments will be conducted as small collaborative projects equipped with skills and means necessary for reaching defined objectives. Application Experiment consortia will typically consist of 3-4 partners including members of the SmartEEs consortium.
Each selected Application Experiment will benefit from a range of technical services, to be provided by SmartEEs competence centres (CEA, CPI, TNO, VTT, EUT, FHG, and IMEC) which will be complemented by a set of non-technical services to be provided by SmartEEs innovation and business developers – BLM, EBN and AMI. Please check the Marketplace Showroom in you wish to discover more than 35 flexible electronics technologies available from competence centres, and please consult the table below for all SmartEEs non-technical services.
|Product development||Management of product development||To support each IC in considering the right design taking into account design to cost, environmental constraints, regulations, and manufacturability|
|IP management||To optimize IP management to generate good value and differentiation for the IC. This is especially important to further attract private investment and customers.|
|Supply chain development and management||To support each IC in identifying the right suppliers, manufacturers and partners along the entire supply chain.|
|Business support||Business case validation||To support each IC in validating the relevance of its innovation opportunity for value creation|
|Market validation – voice of the customer||To support IC in finding the right approach to gather market feedback early on in its product development phase|
|Unique value proposition and business model definition||To support IC in defining its unique value proposition and business model via a mentoring service|
|Business model development||To support IC with brokerage activities through SMARTEES network|
|Access to finance||Validation of business plans||Support IC with good methodology to build and validate business plan|
|Sourcing public funds||Advise IC in the best financing strategy and introduction of support and potential financial partners|
Public Evaluation Reports
If you would like to know more about the SmartEEs cut-off evaluation results, please download the Public Evaluation Reports.
3dr cut-off Public Evaluation Report
4th cut-off Public Evaluation Report
5th cut-off Public Evaluation Report
Selected Application Experiments (AEs)
|Application Experiment title||Innovative Company||Technology partner||Business partner||Sector|
|IoT Flex Node||Small Data Garden (FIN)||VTT (FIN)||AMI (CZ)||Logistics / Packaging|
|ORIGAMO||ItoM Medical (NL)||CPI (UK)||BLM (FR)||Health|
|TEMOSEN||MOVESOLE (FIN)||TNO (NL)||BLM (FR)||Health|
|2nd cut-off||Application Experiment title||Innovative Company||Technology partner||Business partner||Sector|
|FLxE-UTAG||UWINLOC (FR)||EUT (ES)||under definition||Logistics / Packaging|
|SMARTWOOD||SAS WOODOO (FR)||FHG (DE)||under definition||Automotive|
|ETS||La manufacture à Félix (FR)||CEA (FR)||under definition||Sports|
Innovative Companies (ICs)
Small Data Garden the 1st company to implement its IoT Flexi Node with SmartEEs
Movesole Ltd produces smart shoe insoles to measure force and pressure under the feet. Data is collected through smart phone informing the user on track control and feet position. The product is especially developed for the sports and consumer market.
The company is now entering the medical domain with their 2nd generation product. Thereto, Movesole requested SMARTEES to assist in optimizing product design and at the same time include novel sensors to the product.
The challenge in building a smart insole as a medical device is quite big. The smart insole must be robust and reliable in a tough environment including mechanical stress, moisture, sweat, indoor and outdoor usage, and extreme temperature changes all integrated in a 2 dimensional product. Hybrid printed electronics is potentially suitable to meet this challenges.
In the project SMARTEES will utilize SOTA printing techniques completed with the latest sensor development to make the 2nd generation InSOLE, including robustness and quality at a right price point.
La manufacture to implement project ETS together with the SmartEEs team
La manufacture is a non-tech equipment manufacturer of sporting articles made of wood for leisure activities. Our company is located in Garlin, France close to Pyrénées mountains.
Our objective in participating in Smartees project is to develop an IOT version of our products. Our need is indeed to improve technical aspect and confirm the market opportunity of our concept. That is true reason why we are looking for a solution to join IOT technologies in our products in order to provide services to the end user.
SmartEEs flexible electronics to be used by Woodoo for the project SMARTWOOD
Woodoo develops and manufactures translucent wood finished products. The company has developed and patented a new generation of wood materials with advanced physical and optical properties : translucent, touch-sensitive and weatherproof. The material won 25 international innovation awards in 2017, and is to be used for novel wood human-machine interface application in car interiors. Through SmartEEs, we would like to use flexible electronics, more precisely FOLED screens, to be combined with our translucent-tactile wood interface for 3D touch-sensitive dashboards elements.
UWINLOC will integrate flexible electronics to develop flexible tags with project FLxE-UTAG
UWINLOC has developed the world’s first IoT BATTERY-LESS tag for industrial indoor positioning. Its competitive cost makes it affordable for companies to track a high volume of goods at 30cm precision in order to optimize stock and production flows while avoiding manual inventories.
Before UWINLOC, there were no existing solutions available in the market to locate high volumes of assets at high precision. With its current product offer, UWINLOC is improving the current cutting edge asset tracking, however, the product itself has not yet reached an optimum level of specifications to fully address the market opportunity across multiple sectors.
The SmartEEs Application Experiment will focus on the rigid PCB and aims to integrate flexible electronics to develop a flexible tag. The main challenge is to transfer the standard PCB design onto a flexible PCB technology.
This section will include a lit of all public deliverables of the selected Application Experiments. Stay tuned for more information.